Following the launch of the Dimensity 9000 chipset late last year, we saw the key specs of MediaTek’s next-gen 8000 series 5G chips leak earlier this year. And now, MediaTek has officially announced the Dimensity 8000 chip series, which includes the Dimensity 8000 and the Dimensity 8100 5G chipsets. These new MediaTek chipsets will power several 5G flagship smartphones going forward. So, let’s take a look at what they have to offer.
The latest Dimensity 8000 5G series is based on the TSMC’s 5nm architecture and features an octa-core design. MediaTek says it has packed all the advanced technology from its previous Dimensity 9000 chip into the Dimensity 8000 and Dimensity 8100 5G chipsets. In fact, the company suggests that the lower-end Dimensity 8000 chip could be considered as a “little brother” of the flagship Dimensity 9000 chipset.
Other than these, the new Dimensity 8000 series chipsets support up to 200MP cameras and 4K/60 HDR10+ video recording. It is powered by a five-gigapixels per second image signal processor (ISP) to produce clearer HDR images and videos much faster.
Now, coming to smartphones that will include the latest MediaTek chipsets, several OEMs, including OnePlus, Realme, Xiaomi, and Oppo, have confirmed to release Dimensity 8000- and 8100-powered smartphones. Realme recently took to Weibo (screenshot below) to confirm that the upcoming Realme GT Neo 3 will be powered by the latest Dimensity 8100 chipset. It will also support the company’s latest 150W UltraDart Charging technology.
Other than this, OnePlus’ upcoming device, possibly the Nord 3, will also bring Oppo’s latest 150W SuperVOOC fast-charging tech in the market and feature the Dimensity 8100 chipset. Meanwhile, Oppo has confirmed that its K10 series will be the first to pack the Dimensity 8000 chipset.
