After announcing the Dimensity 8000 and 8100 5G SoCs earlier this year, MediaTek has now launched a new mobile chipset under its Dimensity 1000 series called the MediaTek Dimensity 1050. It is the company’s first mmWave 5G chipset to deliver high-speed and reliable 5G internet. The company has also introduced the Dimensity 930 and Helio G99 chipsets alongside. Check out the details below.
The MediaTek Dimensity 1050 SoC is a 5G chipset based on TSMC’s 6nm architecture. It is an octa-core processor, including two ARM Cortex-A78 cores clocked at up to 2.5GHz. It also has an integrated ARM Mali-G610 MC3 GPU and support for up to LPDDR5 RAM and UFS 3.1 storage.
Other than these, the Dimensity 1050 SoC supports the latest Wi-Fi 6E and Bluetooth version 5.2 technologies. It comes with the company’s in-house MediaTek APU 550 to support AI-backed camera features. The chipset also supports MediaTek’s HyperEngine 5.0 gaming technology, up to 108MP cameras, displays with up to 144Hz refresh rate, and more.
Apart from the Dimensity 1050 SoC, MediaTek has added two new chipsets in the form of the Dimensity 930 and the Helio G99. The Dimensity 930 SoC comes with 2CC-CA technology, backed by mixed duplex FDD+TDD to deliver higher speeds and more coverage. The chipset comes with support for the company’s MiraVision HDR video playback, HDR 10+, and displays with up to 120Hz refresh rate. Furthermore, it supports MediaTek’s HyperEngine 3.0 Lite gaming technology to deliver lower latency and maximized battery life.
As for the new Helio G99 processor, the chipset is designed to deliver a high-performance gaming experience on 4G networks with higher throughput rates and improved power efficiency by up to 30%. It comes as a successor to the Helio G96 SoC and should be an attractive option for budget-focused gaming smartphones.
