As promised, MediaTek has taken the wraps off its latest flagship chipsets – Dimensity 1200 and Dimensity 1100 in China today. These chipsets succeed the Dimensity 1000 series and bring along significant improvements across the board.
Both the Dimensity 1200 and Dimensity 1100 are octa-core chipsets based on TSMC’s 6nm architecture, include an integrated 5G modem, and a lot more. First, let’s take a look at what the Dimensity 1200 has to offer.
The chipset also integrates the Helio M70 5G modem, which is coupled with a myriad of MediaTek 5G technologies. It supports True Dual SIM 5G (5G SA + 5G SA), carrier aggregation, SA/ NSA modes, and Voice over New Radio (VoNR). There’s Bluetooth 5.2 and Wi-Fi 6 support onboard as well.
Moving to the lower-specced Dimensity 1100, it is also an octa-core chipset based on TSMC’s 6nm architecture. MediaTek, however, follows a 4+4 CPU arrangement on this chipset as opposed to the 1+3+4 arrangement seen in Dimensity 1200. It is the same as last year’s Dimensity 1000+ SoC but uses the more power-efficient ARM Cortex-A78 cores as opposed to the Cortex-A77 cores.
Now, the biggest question is – when can we expect to see smartphones powered by the Dimensity 1200 and Dimensity 1100 chipsets in the market? MediaTek, in the official blog post, reveals that phone makers Xiaomi, Vivo, Oppo, and Realme have expressed interest in these new chipsets.
Another step towards becoming a #Leaderof5G!@MediaTekIndia is launching its new Dimensity Flagship 5G Smartphone chip and #realme would be one of the first to release a smartphone featuring it.
